A novel efficient TSV built-in test for stacked 3D ICs

Badi GUIBANE; Belgacem HAMDI; Brahim Ben SALEM; Abdellatif MTIBAA

Article Details

A novel efficient TSV built-in test for stacked 3D ICs

Authors:

Badi GUIBANE | Belgacem HAMDI | Brahim Ben SALEM | Abdellatif MTIBAA

Publisher:

TUBITAK

Journal:

Turkish Journal of Electrical Engineering and Computer Science 2018 Vol.26 Issue 4, pp.1909-1921

Document Type:

Article

Publication Date:

7/2018

Document Language:

Turkish

Document ID (Org No.):

2000734941

Frequency:

Bimonthly

eISSN:

1303-6203

pISSN:

1300-0632

Abstract:

 

A through-silicon via (TSV) is established as the main   enabler for a three-dimensional integrated circuit (3D IC) that increases   system density and compactness. The exponential increase in TSV density led   to TSV-induced catastrophic and parametric faults. We propose an original   architecture that detects errors caused by TSV manufacturing defects. The   proposed design for testability is a built-in technique that detects errors   in an early manufacturing stage and is hence very economically attractive.   The proposal is capable of testing each and every TSV in the network. The   technique achieves high fault coverage and high observability.

Article Details

A novel efficient TSV built-in test for stacked 3D ICs

Authors: Badi GUIBANE | Belgacem HAMDI | Brahim Ben SALEM | Abdellatif MTIBAA

Publisher: TUBITAK

Journal: Turkish Journal of Electrical Engineering and Computer Science 2018 Vol.26 Issue 4, pp.1909-1921

Document Type: Article

Publication Date: 7/2018

Document Language: Turkish

Document ID (Org No.): 2000734941

Frequency: Bimonthly

eISSN: 1303-6203

pISSN: 1300-0632

Issues

Authors:

Badi GUIBANE | Belgacem HAMDI | Brahim Ben SALEM | Abdellatif MTIBAA

Publisher:

TUBITAK

Journal:

Turkish Journal of Electrical Engineering and Computer Science 2018 Vol.26 Issue 4, pp.1909-1921

Document Type:

Article

Publication Date:

7/2018

Document Language:

Turkish

Document ID (Org No.):

2000734941

Frequency:

Bimonthly

eISSN:

1303-6203

pISSN:

1300-0632